3C And Semi-Conductor

In 3C, 5G related industries, laser micro-nano processing has replaced the traditional processing methods, to achieve laser cutting, punching, welding, marking, micro-nano structure and removal of the five all-laser processing process, to achieve the processing efficiency and effect of double enhancement.

In the semiconductor industry, Tianhong Laser provides you with solutions covering semiconductor wafer post-processing and industry-specific machines, such as wafer cutting, wafer marking, wafer inspection and other laser application technologies to meet the different needs of semiconductor companies.